"; _cf_contextpath=""; _cf_ajaxscriptsrc="/CFIDE/scripts/ajax"; _cf_jsonprefix='//'; _cf_clientid='C73B3B533B020E36638DC6C6F91EA5C3';/* ]]> */
The LM14S2 Universal 14-Pin Butterfly Laser Diode Mount is designed for use with lasers and two-port electrooptic devices in a 14-pin butterfly package. The top surface has heat sink fins and a recessed region to mount the laser diode, resulting in a low profile package with a temperature coefficient of 3 °C/W. The LM14S2 also includes a laser diode TEC lockout featurea that disables the laser when the TEC controller is not active. The LM14S2 supports maximum laser and TEC currents of 5 A each. In order to utilize the TEC controller, the laser must have an integrated thermoelectric cooler (TEC) or thermistor sensors. This mount also features a zero insertion force (ZIF) socket, a remote safety interlock connection, and an LED to indicate that the laser diode is enabled.
The LM14S2 eliminates the restriction of fixed-pin configuration mounts by using exchangeable configuration cards that plug into a connector located on the bottom of the mount. Two cards are delivered with the LM14S2. One card provides compatibility with both Type 1 Pump Laser Diodes and Type 2 Telecom Laser Diodes. For the pin diagrams that correspond to these types, please refer to the Pin Diagrams tab. The second card is a user-configurable card (LM14S2-UA) designed to allow custom wiring of the mount. Additional user-configurable cards are available and can be ordered separately. Please note that even with an LM14S2-UA, only anode-grounded diodes can be used with the LM14S2 butterfly laser mount. However, due to limitations in heat sinking, it cannot be used with our tapered amplifiers.
In addition to the configurable pinout feature, a bias-T adapter is included, allowing for RF modulation of butterfly lasers specifically designed with this capability. It features a female SMA connector for an RF source up to 500 MHz, and is designed for lasers with a type 2 pin configuration including an internal bias-T and built-in blocking inductor. For more details on the pin assignments, please refer to the Pin Diagrams tab as well as the spec sheet for the specific laser diode to be used. Please note that Thorlabs' butterfly package laser diodes are not compatible with the bias-T adapter.
The LM14S2 is pin-for-pin compatible with all Thorlabs' benchtop laser diode and TEC controllers, and most of our platform laser and TEC controllers as well, eliminating the need for custom-made interface cables. Thorlabs also manufactures customized, application-specific butterfly mounts for OEM customers. Please see the OEM Modules tab for details.
Laser Diode Connector
Bias-T Modulation Adapter*
*RF input for modulation with an external source from 100 kHz to 500 MHz.
Pin Assignment of the 14-pin Sockets
The custom configuration card can be used for any other pin configuration. Additional cards can be ordered separately. Please use item number LM14S2-UA.
Click to Enlarge
Custom Module for 14-Pin Butterfly Packages
Thorlabs OEM Manufacturing
In addition to manufacturing a wide variety of active optical devices, Thorlabs is equipped to deliver customized laser diode, superluminescent diode, and semiconductor optical amplifier modules in OEM quantities. For example, the module shown to the right provides temperature and current control for two superluminescent diodes (SLDs) from an SPI interface. Because this module is designed for standard 14-pin butterfly packages, it is easily adapted for combinations of other optical devices, such as a pigtailed semiconductor laser with an optical amplifier.
As a manufacturer of III-V semiconductor devices, MEMS-VCSEL lasers, quantum cascade lasers, lithium niobate optical modulators, and other devices, we are intimately familiar with the operating requirements of driving lasers and related components. Please visit this webpage for an overview of our laser manufacturing facility, or contact us directly to discuss your application's needs.
Click to Enlarge
Thorlabs' Smart Pack Initiative is aimed at waste minimization while still maintaining adequate protection for our products. By eliminating any unnecessary packaging, implementing packaging design changes, and utilizing eco-friendly packaging materials for our customers when possible, this initiative seeks to improve the environmental impact of our product packaging. Products listed above are now shipped in re-engineered packaging that minimizes the weight and the use of non-recyclable materials.b As we move through our product line, we will indicate re-engineered packages with our Smart Pack logo.