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Low-Voltage Piezoelectric Chips, 0.7 µm - 3.6 µm Travel


  • Low-Voltage Piezo Chips with 75 V, 100 V, or 150 V Max Voltage
  • Sub-Millisecond Response Time with No Load
  • Provided with and without Pre-Attached Wires

PA4DG

Bare Electrode
(2 Places),
Arrow Indicates
Direction of Expansion

PA3CEW

75 mm Wires, Black Dot Indicates Positive Electrode

TA0505D024W

75 mm Wires,
Silver Plus Sign Indicates Positive Electrode

Application Idea

Piezo Chips Tune the Position
of a Ø1" Mirror in a Laser Cavity

PKDESP

End Hemisphere

Related Items


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Piezo Selection Guidea
Piezo Chips
Square
Square with Through Hole
Round
Ring
Tube
Shear
Benders
Piezo Stacks
Discrete, Square
Discrete, Square with Through Hole
Discrete, Round
Discrete, Ring
Discrete, Shear (1D to 3D Positioners)
Co-Fired, Square
Co-Fired or Discrete, Square with Strain Gauges
Piezo Actuators
Mounted
  • For more information about the design and function of piezoelectric chips, please see our piezoelectric tutorial.
Diagram of Piezo Stack
Click to Enlarge

Three-Dimensional Cross Section of Multilayer Piezo with Interdigitated Electrodes (Item # TA0505D024 Shown); Dashed Lines Indicate Cutaway
Piezo Tutorial
Webpage Features
 info icon Clicking this icon below will open a window that contains item specific specifications and mechanical drawings.

Features

  • Sub-Micron Resolution
  • Mounting Face Dimensions from 0.9 mm x 0.9 mm to 10.0 mm x 10.0 mm
  • Drive Voltage Range of 0 - 75 V, 0 - 100 V, or 0 - 150 V
  • Recommended Loads from 13 N (3 lbs) to 1600 N (360 lbs)
  • For Use in Open-Loop Setups
  • Many Chips Available with Pre-Attached Wires
  • Ideal for Vacuum and OEM Applications
  • End Hemispheres and Flat End Plates also Available Separately
Button to Download Piezo Actuator Brochure

Thorlabs' piezoelectric actuators are fabricated from layered sheets of piezoelectric ceramic as is shown in the diagram at upper right and described in the Manufacturing Our Piezoelectric Chips and Stacks box below. Electrodes are printed on each sheet before they are layered, and a precision lapping process ensures the height tolerance of each chip is better than ±5 µm. The compact multilayer design results in chips with high resonant frequencies and sub-millisecond response times. 

These actuators are characterized by precision movement and produce free stroke (unloaded conditions) displacements from 0.7 µm to 3.6 µm. The maximum displacement of these actuators is achieved when they are preloaded with the maximum displacement load, which is specified for each product. The actual value of the maximum displacement varies for each item and must be experimentally determined; however, the maximum displacement will always be larger than the free stroke displacement. Please see the Operation tab for additional information.

Electrodes are included on each layer of the chip, as this minimizes the voltage required to drive them. Our piezoelectric chips are available with one of three drive voltage ranges: 0 - 75 V,
0 - 100 V, or 0 - 150 V. When your application is highly sensitive to voltage, consider our chips with maximum drive voltages of 75 V. For applications that are less sensitive, the 100 V and 150 V options have longer lifetimes. For a complete list of specifications, see the tables below.

Four sides of the chip are coated with a ceramic layer that acts as a barrier against moisture. The ceramic layer offers better protection against moisture than an epoxy coating. Screen-printed silver electrodes are printed on the other two sides of the chip, to which the drive voltage is applied. The positive side will be denoted with either a silver "+" or by a black dot. For convenience, many of our products ship with 75 mm wires soldered to these two sides. 

To accommodate a variety of loading conditions, flat ceramic or hemispherical ceramic endplates may be purchased as accessories for these chips. In addition, Thorlabs offers conical end cups, which are compatible with ball contacts possessing diameters between 1.5 to 7.0 mm. Please see the Operation tab for information on interfacing piezoelectric actuators with loads, special operational considerations, and data that will allow the lifetimes
of these actuators to be estimated when their operational conditions are known.

Piezoelectric chips with custom dimensions, voltage ranges, and coatings are available. Additionally, we support high-volume orders. Please contact
Tech Support for more information.

Piezo Manufacturing

Click to Enlarge

Dicing the PZT Block into Individual Elements

Click to Enlarge

Chips After Binder Burnout and Sintering

Thorlabs' In-House Piezoelectric Manufacturing

Our piezoelectric chips are fabricated in our production facility in China, giving us full control over each step of the manufacturing process. This allows us to economically produce high-quality products, including custom and OEM devices. A glimpse into the fabrication of our piezoelectric chips follows. For more information about our manufacturing process and capabilities, please see our Piezoelectric Capabilities page.

  • Build Blocks from Flexible Sheets of Lead Zirconate Titanate (PZT) Powder
    • Screen Print Electrodes on Each Individual Sheet
    • Layer the Printed Sheets One Top of Another
    • Consolidate the Layered Sheets in an Isostatic Press
  • Dice the Block into Individual Elements
  • Purge Solvent and Binder Material Residues by Heat Treating the Elements
  • Sinter the Elements to Fuse the Piezoelectric Pressed Powder and Grow PZT Crystals
  • Lap the Elements to Achieve Tight Dimensional Tolerances: ±5 µm for Each Element
  • Screen Print the Outer Electrodes on the Elements
  • Align the Individual PZT Crystals Along the Same Axis by Poling the Elements
Mechanical Drawing of Unwired Chip
Click to Enlarge

Schematic of TA0505D024W Piezo Chip

Operation Notes

Power Connections
A positive bias should be applied across the device. The positive electrode should receive positive bias, and the other electrode should be connected to ground. Applying a negative bias across the device may cause mechanical failure. For products that ship with wires attached, the positive wire may be identified in two ways: it is red, as can be seen in the product images, and it is attached to the electrode on the side of the chip indicated by a + mark, as is depicted in the image at right. (On some devices, the + mark is replaced by a dot.) The wire that should be grounded is black, and it is attached to the electrode on the side of the chip opposite the side with the positive electrode.

Preloading
The maximum displacement of these actuators is achieved when they are preloaded with the maximum displacement load, which is specified for each product. The actual value of the maximum displacement varies for each item and must be experimentally determined; however, the maximum displacement will always be larger than the free stroke displacement. Preloading increases the length of the actuator's stroke because the poling process performed during fabrication does not align all ferroelectric grains in the piezoelectric material in the same direction. Preloading the actuator mechanically forces many of the mis-aligned grains into a more ideal alignment. Applying a driving voltage across the piezo material causes the orientations of the ferroelectric grains to rotate so they become aligned with the applied field, and this results in a dimensional change of the piezo material. When more ferroelectric grains are initially aligned in the same direction, the dimensional change of the piezo material in response to the applied driving voltage is greater. Preloads greater than the optimal maximum displacement load result in displacements less than the maximum displacement, as higher loads oppose the switching of the grain orientations in response to the applied driving voltage.

Soldering Wire Leads to the Electrodes
If wire leads must be attached or reattached to the electrodes, a soldering temperature no higher than 370 °C (700 °F) should be used, and heat should be applied to each electrode for a maximum of 2 seconds. Solder the lead to the middle of the electrode and keep the region over which heat is applied as small as possible.

Interfacing a Piezoelectric Element with a Load
Piezoceramics are brittle and have low tensile strength. Avoid loading conditions that subject the actuator to lateral, transverse, or bending forces. When applied incorrectly, an external load that may appear to be compressive can, through bending moments, cause high tensile stresses within the piezoelectric device. Improperly mounting a load to the piezoelectric actuator can easily result in internal stresses that will damage the actuator. To avoid this, the piezoelectric actuator should be interfaced with an external load such that the induced force is directed along the actuator's axis of displacement. The load should be centered on and applied uniformly over as much of the actuator's mounting surface as possible. When interfacing the flat surface of a load with an actuator capped with a flat mounting surface, ensure the two surfaces are highly flat and smooth and that there is good parallelism between the two when they are mated. If the external load is directed at an angle to the actuator's axis of displacement, use an actuator fitted with a hemispherical end plate or a flexure joint to achieve safe loading of the piezoelectric element.

To accommodate a variety of loading conditions, flat ceramic or hemispherical ceramic end plates may be purchased as accessories for these chips. In addition, Thorlabs offers Conical End Cups which feature concave surfaces that can interface with Ø1.5 mm to Ø7.0 mm hemispherical or curved contacts. To attach a load to the piezo chip, we recommend using an epoxy that cures at a temperature lower than 80 °C (176 °F), such as our 353NDPK or TS10 epoxies or Loctite® Hysol® 9340. Loads should be mounted only to the faces of the piezoelectric chip that translate. Mounting a load to a non-translating face may lead to the mechanical failure of the actuator. Some correct and incorrect approaches to interfacing loads with piezoelectric actuators capped with both kinds of end plates are discussed in the following. 

Displacement Plot
Click to Enlarge

Actuation of a lever arm using a piezo element fitted with a flat plate (A, Incorrect), and a hemispherical plate (B, Correct). 
Temperature Rise Plot
Click to Enlarge

Loads properly and improperly mounted to piezo actuators using a variety of interfacing methods. 


The image at left presents incorrect (A, far-left) and correct (B, near-left) methods for using a piezoelectric element to actuate a lever arm. The correct method uses a hemispherical end plate so that, regardless of the angle of the lever arm, the force exerted is always directed along the translational axis of the actuator. The incorrect interfacing of the element and the lever arm, shown at far-left, endangers the piezo element by applying the full force of the load to one edge of the element. This uneven loading causes dangerous stresses in the actuator, including a bending moment around the base.

The image at right shows one incorrect (near-right, A) and three correct approaches for interfacing a flat-bottomed, off-axis load with a piezoelectric actuator. Approaches A and B are similar to the incorrect and correct approaches, respectively, shown in the image at left. Correct approach C shows a conical end cup, such as the PKFCUP, acting as an interface. The flat surface is affixed to the mating surface of the load, and the concave surface fits over the hemispherical dome of the end plate. In the case of correct approach D, a flexure mount acts as an interface between the off-axis flat mounting surface of the load and the flat mounting plate of the actuator. The flexure mount ensures that the load is both uniformly distributed over the surface plate of the actuator and that the loading force is directed along the translational axis of the actuator.

Operating Under High-Frequency Dynamic Conditions
It may be necessary to implement an external temperature-control system to cool the device when it is operated at high frequencies. The maximum operating temperature of these devices is 130 °C (266 °F), and high-frequency operation causes the internal temperature of the piezoelectric device to rise. The dependence of the device temperature on the drive voltage frequency for each product can be accessed by clicking the Info icons, info icon, below. The temperature of the device should not be allowed to exceed its specified maximum operating temperature.

Estimating the Resonant Frequency for a Given Applied Load
A parameter of significance to many applications is the rate at which the piezoelectric actuator changes its length. This dimensional rate of change depends on a number of factors, including the actuator's resonant frequency, the absolute maximum bandwidth of the driver, the maximum current the piezoelectric device can produce, the capacitance of the piezoelectric actuator, and the amplitude of the driving signal. The length of the voltage-induced extension is a function of the amplitude of the applied voltage driving the actuator and the length of the piezoelectric device. The higher the capacitance, the slower the dimensional change of the actuator. 

Quick changes in the applied voltage result in fast dimensional changes to the piezoelectric chip. The magnitude of the applied voltage determines the nominal extension of the chip. Assuming the driving voltage signal resembles a step function, the minimum time, Tmin, required for the length of the actuator to transition between its initial and final values is approximately 1/3 the period of resonant frequency. If there is no load applied to the piezoelectric actuator, its resonant frequency is ƒo and its minimum response time is:


After reaching this nominal extension, there will follow a damped oscillation in the length of the actuator around this position. Controls can be implemented to mitigate this oscillation, but doing so may slow the response of the actuator.

Applying a load to the actuator will reduce the resonant frequency of the piezoelectric chip. Given the unloaded resonant frequency of the actuator, the mass of the chip, m, and the mass of the load, M, the loaded resonant frequency (ƒo') may be estimated: 


Estimating Device Lifetime for DC Drive Voltage Conditions
The lifetime of a piezoelectric device is a function of the operating temperature, applied voltage, and relative humidity conditions. Lifetimes are reduced as a consequence of humidity-driven electrolytic reactions, which occur at the electrodes of the piezoelectric devices when a DC voltage is applied. These reactions both generate hydrogen and result in metal dendrites growing from the cathode towards the anode. The hydrogen liberated by the electrolytic reaction chemically reacts with and degrades the piezoelectric material. Dendrites that grow to electrically connect the cathode and anode result in increasing levels of leakage current. Failed piezoelectric devices are defined as those that exhibit leakage current levels above an established threshold.

A ceramic moisture-barrier layer that insulates Thorlabs' piezoelectric devices on four sides is effective in minimizing the effects of humidity on device lifetime. As there is interest in estimating the lifetime of piezoelectric devices, Thorlabs conducted environmental testing on our ceramic-insulated, low-voltage, piezoelectric actuators. The resulting data were used to create a simple model that estimates the mean time to failure (MTTF), in hours, when the operating conditions of humidity, temperature, and applied voltage are known. The estimated MTTF is calculated by multiplying together three factors that correspond, respectively, to the operational temperature, relative humidity, and fractional voltage of the device. The fractional voltage is calculated by dividing the operational voltage by the maximum specified drive voltage for the device. The factors for each parameter can be read from the following plots, or they may be calculated by downloading the plotted data values and interpolating as appropriate.

In the following trio of plots, the solid-line segment of each curve represents the range of conditions over which Thorlabs performed testing. These are the conditions observed to be of most relevance to our customers. The dotted-line extensions to the solid-line segments represent extrapolated data and represent a wider range of conditions that may be encountered while operating the devices.

Engraved Back of OAP
Click to Enlarge

For an Excel file containing these fT vs. temperature data, please click here.
Calculation of MTTF to Estimate Lifetimes: MTTF = fV * fT * fH
Given the relative humidity conditions, device temperature, and DC operational voltage, the device lifetime can be estimated. It is the product of voltage, temperature, and humidity factors, which can be determined using relationships plotted at right, lower-right, and below.

As an example, when a device of type PK2FSF1 is operated with a voltage of 60 V, at a temperature of 30 °C, and in an environment with 75% relative humidity:
  • From the graph below, the voltage factor is 427 (The maximum rated voltage, Vmax, of the PK2FSF1 is 75 V, giving V/Vmax = 60 V / 75 V = 0.80) 
  • From the graph at right, the temperature factor is 83
  • From the graph at lower-right, the humidity factor is 2.8

Then MTTF = 472 * 83 * 2.8 = 99234.8 hours, which is greater than 11 years.

Note that relationships graphed on this page apply only to Thorlabs' ceramic-insulated, low-voltage, chip-based piezoelectric actuators.


Engraved Back of OAP
Click to Enlarge

For an Excel file containing these fH vs. relative humidity data, please click here.
Engraved Back of OAP
Click to Enlarge

For an Excel file containing these fV vs. V/Vmax data, please click here.

The data used to generate these temperature, voltage, and humidity factor plots resulted from the analysis of measurements obtained from testing devices under six different operational conditions. Different dedicated sets of ten devices were tested under each condition, with each condition representing a different combination of operational voltage, device temperature, and relative humidity. After devices exhibit leakage current levels above a threshold of 100 nA, they are registered as having failed. The individual contributions of temperature, humidity, and voltage to the lifetime are determined by assuming:

  • MTTF = fV(V) * fT(T) * fH(H)
  • A power law dependence for the voltage: fV(V) = A1Vb1
  • An exponential relationship for the relative humidity: fH(T) = A2ecH
  • An Arrhenius relationship for the temperature: fT(H) = A3eb2/T

where A1, A2, A3, b1, b2, and c are constants determined through analysis of the measurement data, V is the DC operational voltage, T is the device temperature, and H is the relative humidity. Because the MTTF has a different mathematical relationship with each factor, the dependence of the MTTF on each factor alone may be determined. These are the data plotted above. The regions of the above curves marked by the blue shading are derived from experimental data. The dotted regions of the curves are extrapolated.

Lifetime testing of these devices continues, and additional data will be published here as they become available.


Posted Comments:
Bernard Alunda  (posted 2019-04-22 23:57:22.65)
Helo, My name is Ben. We are using the piezo chip PA4FKW to drive the Z-scanner of our AFM. We are required to characterize it so that we are able to know its resonant frequency. We are using fiber interferometry for the AC response measurements. We are finding a weird response. When we try other piezo stack actuators, we get a very clean response like the PK4FA2P1 or PK2JA2P2 that we also bought we get very good AC response. Could you kindly help us know what the problem is? If possible could you kindly share with us your typical AC measurement data for the PA4FKW. Thanks you and hoping to hear from you soon. Kind Regards, Ben
nbayconich  (posted 2019-04-23 10:50:58.0)
Thank you for contacting Thorlabs. Would it be possible to provide more details about the strange response you have observed? Could you provide the approximate displacement vs. operating frequency of your PA4FKW that you've observed and could you comment if the device is being operated near the expected theoretical resonant frequency? Please see our resonant frequency plots provided on our webpage. The displacement of the piezo device should not change as a function of frequency as long as the device is operated far from the resonant frequency of the piezo. A Techsupport representative will reach out to you directly.
user  (posted 2019-03-19 10:09:07.663)
Hello, I am confused about the unit used in the Frequency vs load datasheets. I guess "g" doesn't refer to "gram" but "gravity". It that correct?
nbayconich  (posted 2019-03-26 11:06:44.0)
Thank you for contacting Thorlabs. The applied load is in units of grams for the resonant frequency plots.
Bernard Alunda  (posted 2019-03-15 00:08:02.643)
Helo, I am using the PA4FKW piezo chip in my design. Currently, I am doing simulations to ascertain the best design. I order to effectively do so, I need to know certain properties of the piezo chip. 1. What us the piezo coefficient (coupling coefficient)? 2. How many layers does the PA4FKW chip has. 3. What are the Young's modulus, Poisson's ratio and density. Thank you. Warmest regards, Ben
nbayconich  (posted 2019-03-19 10:23:30.0)
Thank you for contacting Thorlabs. These piezo stacks are made from THP51 type piezo material. The Relative dielectric constant is 3300 piezoelectric charge constant d33 is 710 x 10^12 C/N Young's modulus is approximately ~63GPa Poisson's ratio: ~0.32 Density of material: 7.7 (10^3kg/m^3) These piezo stacks have 35 layers. For more information please see our piezo brochure in the link below. https://www.thorlabs.com/images/Brochures/Thorlabs_Piezo_Brochure.pdf
237627542  (posted 2017-11-05 09:36:00.063)
Hi, I wanted to know if the maximum input voltage we got is 10V, what is the influence to the Maximum Displacement? Regards
nbayconich  (posted 2017-12-18 08:07:15.0)
Thank you for contacting Thorlabs. The maximum displacement varies for each item and must be experimentally determined but is generally 10% - 20% larger than the free stroke displacement. The free stroke displacement plots can be downloaded from our webpage under the info icons.
user  (posted 2017-07-10 15:30:41.797)
Hi,I'm Chenning Tao, a MSc student at Imperial College London. We want to know the material of PA4FK-25 piezoelectric chip as we are doing simulations in Comsol. Is it PZT-5H or others? Thanks.
tfrisch  (posted 2017-08-08 11:46:02.0)
Hello, thank you for contacting Thorlabs. The material is THP51, please contact techsupport@thorlabs.com for more details.
shaileshk  (posted 2016-09-01 22:14:06.907)
I wanted to know, whether the Piezoelectric Chips operate at low temperatures (T ~ 70 K) also. If not, what is the temperature dependent. regards
tfrisch  (posted 2016-09-01 02:31:20.0)
Hello, thank you for contacting Thorlabs. Our piezo chips are specified as low as -25°C, and they should not be used at 70K.
alialsaq  (posted 2014-04-17 13:57:30.21)
Hi, I am Ali Alsaqqa, a PhD student at the University at Buffalo, NY, USA. We want to know whether the piezo controllers have a LabView drivers or not (if not, we cannot buy them). Regards, Ali
jlow  (posted 2014-04-17 02:04:03.0)
Response from Jeremy at Thorlabs: Our piezo controllers can be used with LabVIEW.
user  (posted 2014-04-16 13:47:12.39)
Are these piezos vacuum compatible?
jlow  (posted 2014-04-18 08:05:33.0)
Response from Jeremy at Thorlabs: These piezo chips are vacuum compatible to at least 10^-7 Torr (our test vacuum chamber limitation at the moment).

75 V Piezoelectric Chips

Key Specificationsa
Item # Info Pre-Attached
Wires
Displacement
(Free Stroke)b
Dimensions Resonant
Frequencyb
Load for Maximum Displacementc Blocking Forced
PA2AB info No 0.7 µm ± 15% 0.9 mm x 0.9 mm x 0.8 mm 1350 kHz 13 N (3 lbs) 32 N (7.2 lbs)
PA2AD info No 1.1 µm ± 15% 0.9 mm x 0.9 mm x 1.5 mm 850 kHz 13 N (3 lbs) 32 N (7.2 lbs)
PA2JE info No 2.0 µm ± 15% 3.0 mm x 3.0 mm x 2.0 mm 450 kHz 144 N (32 lbs) 360 N
(81 lbs)
PA2JEW info Yes
TA0505D024 info No 2.8 µm ± 15% 5.0 mm x 5.0 mm x 2.4 mm 315 kHz 400 N (90 lbs) 1000 N
(225 lbs)
TA0505D024W info Yes
  • For complete specifications, please see the Info Icons () above.
  • Without Load
  • Displacement varies with loading. When used with this load, these chips achieve the maximum displacement, which is larger than the free stroke displacement.
  • At Max Voltage
Based on your currency / country selection, your order will ship from Newton, New Jersey  
+1 Qty Docs Part Number - Universal Price Available
PA2AB Support Documentation
PA2ABPiezo Chip, 75 V, 0.7 µm Displacement, 0.9 × 0.9 × 0.8 mm, Bare Electrodes
$28.11
Volume Pricing
Today
PA2AD Support Documentation
PA2ADCustomer Inspired! Piezo Chip, 75 V, 1.1 µm Displacement, 0.9 x 0.9 x 1.5 mm, Bare Electrodes
$29.16
Volume Pricing
Today
PA2JE Support Documentation
PA2JEPiezo Chip, 75 V, 2.0 µm Displacement, 3.0 x 3.0 x 2.0 mm, Bare Electrodes
$26.79
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PA2JEW Support Documentation
PA2JEWPiezo Chip, 75 V, 2.0 µm Displacement, 3.0 x 3.0 x 2.0 mm, Pre-Attached Wires
$29.16
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Today
TA0505D024 Support Documentation
TA0505D024Piezo Chip, 75 V, 2.8 µm Displacement, 5.0 x 5.0 x 2.4 mm, Bare Electrodes
$32.31
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TA0505D024W Support Documentation
TA0505D024WPiezo Chip, 75 V, 2.8 µm Displacement, 5.0 x 5.0 x 2.4 mm, Pre-Attached Wires
$34.41
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Today

100 V Piezoelectric Chips

Key Specificationsa
Item # Info Pre-Attached
Wires
Displacement
(Free Stroke)b
Dimensions Resonant
Frequencyb
Load for Maximum Displacementc Blocking Forced
PA3BC info No 1.0 µm ± 15% 1.5 mm x 1.5 mm x 1.0 mm 920 kHz 36 N (8 lbs) 90 N (20 lbs)
PA3BCW info Yes
PA3JE info No 1.8 µm ± 15% 3.0 mm × 3.0 mm × 2.0 mm 450 kHz 144 N (32 lbs) 360 N (81 lbs)
PA3JEW info Yes
PA3CE info No 2.0 µm ± 15% 2.0 mm × 2.0 mm × 2.0 mm 560 kHz 65 N (15 lbs) 160 N (36 lbs)
PA3CEW info Yes
PA3JEA info No 2.2 µm ± 15% 3.0 mm × 3.0 mm × 2.0 mm 450 kHz 144 N (32 lbs) 360 N (81 lbs)
PA3JEAW info Yes
PA3CK info No 3.0 µm ± 15% 2.0 mm x 2.0 mm x 3.0 mm 415 kHz 65 N (15 lbs) 160 N (36 lbs)
PA3CKW info Yes
  • For complete specifications, please see the Info Icons () above.
  • Without Load
  • Displacement varies with loading. When used with this load, these chips achieve the maximum displacement, which is larger than the free stroke displacement.
  • At Max Voltage
Based on your currency / country selection, your order will ship from Newton, New Jersey  
+1 Qty Docs Part Number - Universal Price Available
PA3BC Support Documentation
PA3BCCustomer Inspired! Piezo Chip, 100 V, 1.0 µm Displacement, 1.5 x 1.5 x 1.0 mm, Bare Electrodes
$24.69
Volume Pricing
Today
PA3BCW Support Documentation
PA3BCWPiezo Chip, 100 V, 1.0 µm Displacement, 1.5 x 1.5 x 1.0 mm, Pre-Attached Wires
$26.79
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Today
PA3JE Support Documentation
PA3JEPiezo Chip, 100 V, 1.8 µm Displacement, 3.0 x 3.0 x 2.0 mm, Bare Electrodes
$29.16
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PA3JEW Support Documentation
PA3JEWPiezo Chip, 100 V, 1.8 µm Displacement, 3.0 x 3.0 x 2.0 mm, Pre-Attached Wires
$31.26
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PA3CE Support Documentation
PA3CEPiezo Chip, 100 V, 2.0 µm Displacement, 2.0 x 2.0 x 2.0 mm, Bare Electrodes
$23.64
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PA3CEW Support Documentation
PA3CEWPiezo Chip, 100 V, 2.0 µm Displacement, 2.0 x 2.0 x 2.0 mm, Pre-Attached Wires
$25.74
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PA3JEA Support Documentation
PA3JEACustomer Inspired! Piezo Chip, 100 V, 2.2 µm Displacement, 3.0 x 3.0 x 2.0 mm, Bare Electrodes
$29.16
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PA3JEAW Support Documentation
PA3JEAWCustomer Inspired! Piezo Chip, 100 V, 2.2 µm Displacement, 3.0 x 3.0 x 2.0 mm, Pre-Attached Wires
$31.26
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PA3CK Support Documentation
PA3CKPiezo Chip, 100 V, 3.0 µm Displacement, 2.0 x 2.0 x 3.0 mm, Bare Electrodes
$24.79
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PA3CKW Support Documentation
PA3CKWPiezo Chip, 100 V, 3.0 µm Displacement, 2.0 x 2.0 x 3.0 mm, Pre-Attached Wires
$26.79
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150 V Piezoelectric Chips

Key Specificationsa
Item # Info Pre-Attached
Wires
Displacement
(Free Stroke)b
Dimensions Resonant
Frequencyb
Load for Maximum Displacementc Blocking Forced
PA4CE info No 2.0 µm ± 15% 2.0 mm × 2.0 mm × 2.0 mm 560 kHz 65 N (15 lbs) 160 N (36 lbs)
PA4CEW info Yes
PA4HE info No 2.1 µm ± 15% 10.0 mm × 10.0 mm × 2.0 mm 165 kHz 1600 N (360 lbs) 4000 N (900 lbs)
PA4HEW info Yes
PA4JE info No 2.2 µm ± 15% 3.0 mm × 3.0 mm × 2.0 mm 450 kHz 144 N (32 lbs) 360 N (81 lbs)
PA4JEW info Yes
PA4GE info No 2.2 µm ± 15% 7.0 mm × 7.0 mm × 2.0 mm 225 kHz 785 N (177 lbs) 1960 N (441 lbs)
PA4GEW info Yes
PA4DG info No 2.3 µm ± 15% 2.5 mm × 2.5 mm × 2.3 mm 470 kHz 100 N (22 lbs) 250 N (56 lbs)
PA4DGW info Yes
PA4FE info No 2.5 µm ± 15% 5.0 mm × 5.0 mm × 2.0 mm 310 kHz 400 N (90 lbs) 1000 N (225 lbs)
PA4FEW info Yes
PA4GK info No 3.4 µm ± 15% 7.0 mm x 7.0 mm x 3.0 mm 220 kHz 785 N (177 lbs) 1960 N (441 lbs)
PA4GKW info Yes
PA4JK info No 3.5 µm ± 15% 3.0 mm x 3.0 mm x 3.0 mm 355 kHz 144 N (32 lbs) 360 N (81 lbs)
PA4JKW info Yes
PA4HK info No 3.5 µm ± 15% 10.0 mm × 10.0 mm × 3.0 mm 160 kHz 1600 N (360 lbs) 4000 N (900 lbs)
PA4HKW info Yes
PA4FK info No 3.6 µm ± 15% 5.0 mm × 5.0 mm × 3.0 mm 270 kHz 400 N (90 lbs) 1000 N (225 lbs)
PA4FKW info Yes
  • For complete specifications, please see the Info Icons () above.
  • Without Load
  • Displacement varies with loading. When used with this load, these chips achieve the maximum displacement, which is larger than the free stroke displacement.
  • At Max Voltage
Based on your currency / country selection, your order will ship from Newton, New Jersey  
+1 Qty Docs Part Number - Universal Price Available
PA4CE Support Documentation
PA4CEPiezo Chip, 150 V, 2.0 µm Displacement, 2.0 x 2.0 x 2.0 mm, Bare Electrodes
$23.64
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PA4CEW Support Documentation
PA4CEWPiezo Chip, 150 V, 2.0 µm Displacement, 2.0 x 2.0 x 2.0 mm, Pre-Attached Wires
$25.74
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PA4HE Support Documentation
PA4HEPiezo Chip, 150 V, 2.1 µm Displacement, 10.0 x 10.0 x 2.0 mm, Bare Electrodes
$64.35
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PA4HEW Support Documentation
PA4HEWPiezo Chip, 150 V, 2.1 µm Displacement, 10.0 x 10.0 x 2.0 mm, Pre-Attached Wires
$66.46
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PA4JE Support Documentation
PA4JEPiezo Chip, 150 V, 2.2 µm Displacement, 3.0 x 3.0 x 2.0 mm, Bare Electrodes
$26.79
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PA4JEW Support Documentation
PA4JEWPiezo Chip, 150 V, 2.2 µm Displacement, 3.0 x 3.0 x 2.0 mm, Pre-Attached Wires
$29.16
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PA4GE Support Documentation
PA4GEPiezo Chip, 150 V, 2.2 µm Displacement, 7.0 x 7.0 x 2.0 mm, Bare Electrodes
$45.18
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PA4GEW Support Documentation
PA4GEWPiezo Chip, 150 V, 2.2 µm Displacement, 7.0 x 7.0 x 2.0 mm, Pre-Attached Wires
$47.28
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PA4DG Support Documentation
PA4DGCustomer Inspired! Piezo Chip, 150 V, 2.3 µm Displacement, 2.5 x 2.5 x 2.3 mm, Bare Electrodes
$26.79
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PA4DGW Support Documentation
PA4DGWCustomer Inspired! Piezo Chip, 150 V, 2.3 µm Displacement, 2.5 x 2.5 x 2.3 mm, Pre-Attached Wires
$29.16
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PA4FE Support Documentation
PA4FEPiezo Chip, 150 V, 2.5 µm Displacement, 5.0 x 5.0 x 2.0 mm, Bare Electrodes
$30.21
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PA4FEW Support Documentation
PA4FEWPiezo Chip, 150 V, 2.5 µm Displacement, 5.0 x 5.0 x 2.0 mm, Pre-Attached Wires
$32.31
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PA4GK Support Documentation
PA4GKPiezo Chip, 150 V, 3.4 µm Displacement, 7.0 x 7.0 x 3.0 mm, Bare Electrodes
$53.58
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PA4GKW Support Documentation
PA4GKWPiezo Chip, 150 V, 3.4 µm Displacement, 7.0 x 7.0 x 3.0 mm, Pre-Attached Wires
$55.95
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PA4JK Support Documentation
PA4JKPiezo Chip, 150 V, 3.5 µm Displacement, 3.0 x 3.0 x 3.0 mm, Bare Electrodes
$25.75
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PA4JKW Support Documentation
PA4JKWPiezo Chip, 150 V, 3.5 µm Displacement, 3.0 x 3.0 x 3.0 mm, Pre-Attached Wires
$27.81
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PA4HK Support Documentation
PA4HKPiezo Chip, 150 V, 3.5 µm Displacement, 10.0 x 10.0 x 3.0 mm, Bare Electrodes
$81.69
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PA4HKW Support Documentation
PA4HKWPiezo Chip, 150 V, 3.5 µm Displacement, 10.0 x 10.0 x 3.0 mm, Pre-Attached Wires
$83.79
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PA4FK Support Documentation
PA4FKPiezo Chip, 150 V, 3.6 µm Displacement, 5.0 x 5.0 x 3.0 mm, Bare Electrodes
$33.36
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PA4FKW Support Documentation
PA4FKWPiezo Chip, 150 V, 3.6 µm Displacement, 5.0 x 5.0 x 3.0 mm, Pre-Attached Wires
$35.46
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End Cups

  • Compatible with Our Piezoelectric Chips (Sold Above)
  • Use with End Hemispheres Available Below
  • Conical End Cups Accept Ball Contacts:
    • From Ø1.5 mm to Ø3.0 mm (PKJCUP)
    • From Ø2.6 mm to Ø5.0 mm (PKFCUP)
    • From Ø3.6 mm to Ø7.0 mm (PKGCUP)
  • Restricts Applied Stress to the Axial Direction
  • Sold in Packs of 10

The PKJCUP, PKFCUP, and PKGCUP are 416 stainless steel conical end cups designed to be used with our piezoelectric chips when interfaced with the end hemispheres sold below. The conical cup can accept a ball contact, such as one of the end hemispheres available below, with a diameter from 1.5 to 3.0 mm (PKJCUP), 2.6 to 5.0 mm (PKFCUP), or 3.6 to 7.0 mm (PKGCUP). Using a ball contact with a piezo actuator ensures that the applied stress is restricted to the axial direction, limiting the probability of stress-induced failure. They can be affixed either to a flat face of a piezo chip or to the mechanical device that is being actuated. If affixing a cup to the chip itself, we recommend using an epoxy that cures at a temperature lower than 80 °C (176 °F), such as 353NDPK or TS10 epoxies or Loctite® Hysol® 9340.

Based on your currency / country selection, your order will ship from Newton, New Jersey  
+1 Qty Docs Part Number - Universal Price Available
PKJCUP Support Documentation
PKJCUPØ3.0 mm Conical End Cup for PZT Actuators, Pack of 10
$36.51
Today
PKFCUP Support Documentation
PKFCUPCustomer Inspired! Ø5.0 mm Conical End Cup for PZT Actuators, Pack of 10
$25.74
Today
PKGCUP Support Documentation
PKGCUPØ7.0 mm Conical End Cup for PZT Actuators, Pack of 10
$47.28
Today

End Hemispheres and Flat End Plates

End Hemispheres Flat End Plates Compatible
Piezo Chips
Item # Diameter Item # Dimensions
PKCESP 2.0 mm PKCEP4 2.0 mm x 2.0 mm x 0.4 mm PA3CE(W), PA3CK(W), PA4CE(W)
PKDESP 2.5 mm PKDEP4 2.5 mm x 2.5 mm x 0.4 mm PA4DG(W)
PKJESP 3.0 mm PKJEP4 3.0 mm x 3.0 mm x 0.4 mm PA2JE(W), PA3JE(W),
PA3JEA(W), PA4JE(W),
PA4JK(W)
PKFESP 5.0 mm PKFEP4 5.0 mm x 5.0 mm x 0.4 mm TA0505D024(W),
PA4FE(W), PA4FK(W)
PKGESP 7.0 mm PKGEP4 7.0 mm x 7.0 mm x 0.4 mm PA4GE(W), PA4GK(W)
PKHESP 10.0 mm PKGESP 10.0 mm x 10.0 mm x 0.4 mm PA4HE(W), PA4HK(W)
  • End Hemispheres and Flat End Plates in Six Sizes
  • Hemispheres Provide a Single Point of Contact
    for Actuation
  • Flat Plates Spread Force Across Piezo Face at Contact Point
  • Sold in Packs of 16 or 25

The alumina end hemispheres and flat end plates used in our piezoelectric stacks are also available separately in six sizes (see the table to the right). The hemispheres can be used to create a single contact point between a PZT stack and a lever arm. Alternatively, a hemisphere can be used with a compatible conical end cup (sold above). End plates are used to spread the force at the contact point over the entire surface of the piezo stack. When selecting an end hemisphere or flat end plate to adhere to a piezo stack end face, it is important to match the bottom surface area of the hemisphere or plate to the cross section of the piezo stack in order to ensure that forces are spread evenly over the surface. The end hemispheres have a diameter tolerance of ±0.1 mm, and the end plates have a dimensional tolerance of ±0.04 mm. To secure the end hemisphere or the flat end plate to a piezo actuator, any epoxy that cures at a temperature lower than 80 °C is considered safe to use. We suggest using Thorlabs’ 353NDPK High-Temperature Expoy or TS10 Vacuum Epoxy. Additionally, Loctite® Hysol® 9340 can also be used.

Based on your currency / country selection, your order will ship from Newton, New Jersey  
+1 Qty Docs Part Number - Universal Price Available
PKCESP Support Documentation
PKCESPCustomer Inspired! Ø2.0 mm End Hemisphere, Pack of 25
$33.36
Today
PKDESP Support Documentation
PKDESPCustomer Inspired! Ø2.5 mm End Hemisphere, Pack of 25
$33.36
Today
PKJESP Support Documentation
PKJESPCustomer Inspired! Ø3.0 mm End Hemisphere, Pack of 25
$33.36
Today
PKFESP Support Documentation
PKFESPCustomer Inspired! Ø5.0 mm End Hemisphere, Pack of 25
$33.36
Today
PKGESP Support Documentation
PKGESPCustomer Inspired! Ø7.0 mm End Hemisphere, Pack of 16
$29.16
Today
PKHESP Support Documentation
PKHESPCustomer Inspired! Ø10.0 mm End Hemisphere, Pack of 16
$46.49
Today
PKCEP4 Support Documentation
PKCEP4Customer Inspired! 2.0 mm x 2.0 mm x 0.4 mm Flat End Plate, Pack of 25
$9.66
Today
PKDEP4 Support Documentation
PKDEP4Customer Inspired! 2.5 mm x 2.5 mm x 0.4 mm Flat End Plate, Pack of 25
$9.66
Today
PKJEP4 Support Documentation
PKJEP4Customer Inspired! 3.0 mm x 3.0 mm x 0.4 mm Flat End Plate, Pack of 25
$9.66
Today
PKFEP4 Support Documentation
PKFEP4Customer Inspired! 5.0 mm x 5.0 mm x 0.4 mm Flat End Plate, Pack of 25
$11.88
Today
PKGEP4 Support Documentation
PKGEP4Customer Inspired! 7.0 mm x 7.0 mm x 0.4 mm Flat End Plate, Pack of 16
$10.71
Today
PKHEP4 Support Documentation
PKHEP4Customer Inspired! 10.0 mm x 10.0 mm x 0.4 mm Flat End Plate, Pack of 16
$17.23
Today
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Last Edited: Dec 06, 2013 Author: Dan Daranciang