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Ultrasonic Ring Chips & Langevin Transducers![]()
PA40ND5 35 kHz Ring Chip PA40TM 26 kHz Ring Chip PKT40A Langevin Transducer, PKT40B Langevin Transducer, ![]() Please Wait
![]() Click to Enlarge PKT40A Langevin Transducer (Left), Connector (Center), and Sonotrode/Horn (Right) Features
Thorlabs offers hard PZT material ring elements as chips with bare electrodes for use in ultrasonic vibration applications and integrated into Langevin transducers designed for use in ultrasonic welding. The PA40ND5 Ring Chip with 50 mm outer diameter (OD), 17 mm inner diameter (ID), and 6.5 mm thickness provides a 35 kHz resonant frequency as the work frequency; our PKT40A Langevin Transducer with four PA40ND5 chips provides a 20 kHz resonant frequency as the work frequency and an instantaneous power of 700 W. The PA40TM Ring Chip with 60 mm OD, 30 mm ID, and 10 mm thickness provides a 26 kHz resonant frequency as the work frequency; our PKT40B Langevin Transducer with four PA40TM chips provides a 15 kHz resonant frequency as the work frequency and an instantaneous power of 500 W. The hard PZT material in these ultrasonic piezo chips and transducers can be driven at up to 5 kV, but operation above 3 kV may create an arc in the air. Protective measures such as silicone oil should be applied when the voltage is above 3 kV; for a complete list of specifications, see the tables below. We recommend driving clamped chips or transducers using a sine wave at the work frequency with a voltage of 0 - 5 kV. The graphs in the info icons in the tables below illustrate the sharp phase angle slope around the resonant frequency of the devices. The sharp phase angle slope is useful for tracking the resonant frequency which may shift during operation due to temperature changes. Hard vs. Soft PZT Material Piezo chips with custom dimensions, voltage ranges, and coatings are available. Additionally, customers can order these piezo chips in high-volume quantities. Please contact OEM Sales for more information. Thorlabs' In-House Piezoelectric ManufacturingOur piezoelectric chips are fabricated in our production facility in China, giving us full control over each step of the manufacturing process. This allows us to economically produce high-quality products, including custom and OEM devices. A glimpse into the fabrication of our piezoelectric chips follows. For more information about our manufacturing process and capabilities, please see our Piezoelectric Capabilities page.
Ring Chip Operation NotesElectrical Considerations When soldering wires to the electrodes, use a soldering iron at a temperature no greater than 370 °C (700 °F) for a maximum of 2 seconds per spot. Solder to the middle of the electrode, keeping the spot as small as possible. Electrical Shock and Discharge Caution After being driven, the piezo is fully charged. Directly connecting the positive and negative electrodes may result in a spark and/or device failure. It is recommended to discharge using a resistor (>1 kΩ) between the positive and negative electrodes. Attaching Devices to the Piezo Chip Loads should only be attached to the center of the flat faces since the edges do not translate. Attaching a load to the edges may lead to mechanical failure. Langevin Transducer Operation NotesElectrical Considerations When soldering wires to the copper foil electrodes, use a soldering iron at a temperature no greater than 370 °C (700 °F) for a maximum of 2 seconds per spot, soldering to the middle of the electrode. Electrical Shock and Discharge Caution After being driven, the piezo is fully charged. Directly connecting the positive and negative electrodes may result in a spark and/or device failure. It is recommended to discharge using a resistor (>1 kΩ) between the positive and negative electrodes. Attaching Devices to the Transducer Caution: When operating at the resonant frequency, high voltages will be applied to the transducer which will generate high frequency forces as well as heat. Do not touch any part of the device to avoid risk of injury from electric discharge, vibration, or heat. When operated for extended periods, cooling the piezo chips and metal components by rapid air flow is recommended. Storage Instructions
![]() These ring chips have bare electrodes with the positive pole marked by an engraved '+'; the other electrode should be connected to the negative pole of the driver or grounded. For more details, see the Operation tab. Ultrasonic Applications
![]() Each transducer contains a discrete stack of four ring chips clamped with a bolt between two metal housings. Each stack has copper foil electrodes; the positive pole only contacts the piezo chips, while the negative pole is also connected to the metal housing, which should be connected to the negative pole of the driver or grounded. For more details, see the Operation tab. The assembly bolt at the top is tightened to a specific torque and its thread is locked; it should not be loosened or removed. The PKT40A and PKT40B transducers can be mounted via the holes in the base which have M16 x 2.0 and M20 x 1.5 taps, respectively. | ||||||||||||||||||||||||||||
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